Alloy bonded graphene sheets for enhanced thermal spreaders
US9736923B1 · kind B1 · utility
1Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2017 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Jan 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/06
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.