Heat sink with integrated threaded lid
US9736966B1 · kind B1 · utility
2Cited by
24References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2016 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Feb 10, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink structure includes a heat sink; a threaded heat sink base pocket within the heat sink; a module lid, where the module lid thermally interfaces with a die; a threaded exterior portion of the module lid; and a thread engagement between the threaded heat sink base pocket and the threaded exterior portion of the module lid, where the thread engagement mechanically couples the heat sink to the module lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.