Device for clamping a printed circuit board module in a mounting groove
US9736968B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2013 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Sep 16, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/7067
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device for retaining a printed circuit board module in a mounting groove of a cold plate, the device comprising an elongated housing made of metal, which has a cross-section in the shape of a horizontal U. A pressure piece made of metal is mounted in the housing so as to be displaceable transversely relative to the rotational axis of the housing and comprises a flat clamping surface on the front side. A rotary cylinder can be rotatably mounted in the housing so as to be transversely displaceable relative to the rotational axis. During a rotation, eccentric guide elements can be used to effect a forward displacement of the rotary cylinder. The pressure piece follows the displacement of the rotary cylinder and slides outward. The waste heat of the printed circuit board module is transported via the housing and the pressure piece to the cold plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.