Machine for the plasma treatment of containers, comprising offset depressurization/pressurization circuits
US9737909B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2007 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Sep 23, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D2201/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Machine (1) for the plasma treatment of containers (3), which comprises: a chamber (5) suitable for receiving a container (3) to be treated, a cover (8) defining a nozzle (9) in the extension of the chamber (5); a duct (14) for depressurization the container (3), which duct opens into the nozzle (9) and connects the latter to a vacuum source (15); a first valve (19) having a closed position, in which it closes off the depressurization duct (14), and an open position, in which it brings the nozzle (9) and the vacuum source (15) into communication; a duct (27) for pressurizing the container (3), separate from the depressurization duct (14), this pressurization duct (27) emerging in the nozzle (9) beyond the depressurization duct (14) and connecting the nozzle (9) to a pressure source (28); and a second valve (29) having a closed position, in which it closes off the pressurization duct (27), and an open position, in which it brings the nozzle (9) and the pressure source (28) into communication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.