Mold component
US9738012B2 · kind B2 · utility
7Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2014 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Sep 24, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
There is provided a member of a mold stack (100, 800), the member comprising: a member body (102, 802) defining a member molding surface for defining, in use, a portion of a molding cavity for molding a molded article, a member cooling circuit (120, 820) having a plurality of member cooling channels (128, 829), the plurality of member cooling channels (128, 829) being coupled in parallel to a source of cooling fluid, the member cooling circuit (120, 820) being fully encapsulated within the member body (102, 802).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.