Electrochemical etching apparatus
US9738987B2 · kind B2 · utility
1Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2015 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Mar 24, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01B32/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating etching apparatus includes a power to output current, and a container configured to contain an electrolyte. A cathode is coupled to the container and configured to fluidly communicate with the electrolyte. An anode is electrically connected to the output, and includes a graphene layer. A metal substrate layer is formed on the graphene layer, and is etched from the graphene layer in response to the current flowing through the anode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.