Pressing force sensor
US9739671B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2015 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Dec 25, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L5/0038
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressing force sensor that includes a sensor element configured with a piezoelectric film, a lead terminal for connection to an external circuit, a wiring conductor which connects pressing force detection electrodes and the lead terminal, and a flexible printed circuit board which withstands solder reflow temperatures. The flexible printed circuit board has the pressing force detection electrodes formed on a first principal surface thereof, and is folded via a folding line while the first principal surface faces inward. The sensor element is deflected by a pressing force applied to a second principal surface which faces outward and is in a first area of the flexible printed circuit board which is on one side with respect to the folding line, and a signal corresponding to the pressing force is thus taken out from the pressing force detection electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.