Method for producing optoelectronic semiconductor components, leadframe assembly and optoelectronic semiconductor component
US9741616B2 · kind B2 · utility
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6References
5Claims
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Key dates
| Filing date | May 3, 2013 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Dec 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, the method is configured for producing optoelectronic semiconductor components (1) and includes the steps of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.