Array substrate and manufacturing method thereof, and display apparatus thereof
US9741753B2 · kind B2 · utility
2Cited by
0References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 22, 2016 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Jun 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/123
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the present disclosure provides an array substrate and a manufacturing method thereof and a display apparatus. The array substrate includes a base substrate, wherein, the base substrate is provided with a bonding region; a bonding pad and a first bonding lead connected with the bonding pad and extending to an edge of the base substrate are provided in the bonding region, and one or more metal patterns are arranged above the first bonding lead, the one or more metal patterns crossing over the first bonding lead and being insulated from the first bonding lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.