Magnetic sensor having a recessed die pad
US9741924B2 · kind B2 · utility
0Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2016 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Feb 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q2213/307
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A magnetic sensor has a pair of Hall elements formed in spaced-apart relationship on a front surface of a semiconductor substrate. A die pad is bonded to a back surface of the semiconductor substrate and overlaps the Hall elements. The die pad has formed therein a magnetic converging plate holder having a recessed portion, and a magnetic converging plate having the same shape and size as the recessed portion is fitted in the recessed portion of the magnetic converging plate holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.