Method for processing an electronic component and electronic component arrangement

US9741965B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Erwin Lang · Regensburg, DE
• Philipp Schwamb · Regensburg, DE
• Simon Schicktanz · Regensburg, DE

Key dates

• Filing date: Jun 13, 2014
• Grant date: Aug 22, 2017
• Expiry date: Jun 13, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

Various embodiments may relate to a method for processing an electronic component. The method includes applying a planar structure provided with predetermined separation locations to the electronic component, and removing a part of the applied planar structure, wherein removing includes separating the planar structure at the predetermined separation locations.