Patent · US Active

Device for transmitting between a microstrip on a circuit board and a waveguide using a signal line disposed within a housing that is soldered to the circuit board

US9742052B2 · kind B2 · utility

1Cited by

3References

18Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Juergen Hasch · Stuttgart, DE
Elena Pancera · Leonberg, DE
Carsten Potratz · Gerlingen, DE
Dirk Schmidt · Königstein, DE

Key dates

Filing date	Sep 11, 2015
Grant date	Aug 22, 2017
Priority date	—
Expiry date	Nov 25, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01P5/107
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

A device for transmitting millimeter-wave signals between a microstrip formed on a circuit board and a waveguide, characterized by a housing which is soldered onto the circuit board with the aid of solder contacts and which contains a signal line, which is connected to the microstrip via a soldered connection suitable for use at high frequencies, and which connects this microstrip to a coupling point for the millimeter-wave signals, the coupling point facing the waveguide.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.