Resin composition, prepreg and metal-foil-clad laminate
US9743515B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2009 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Jul 1, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/30
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether structure, a naphthol aralkyl cyanate ester resin (b), a bisphenol A cyanate ester resin (c), a brominated flame retardant (d) and an inorganic filler (e). The resin composition is for use in a printed wiring board for high multilayer and high frequency, and is excellent in moldability, electric characteristics, peel strength, flame resistance and heat resistance after moisture absorption. Further, a prepreg comprising the above resin composition and a glass woven fabric, a metal-foil-clad laminate obtained by disposing a metal foil on one side or both sides of a stack of at least one prepreg and laminate-molding the resultant set, and a resin sheet obtained by applying a solution of the above resin composition to a surface of a metal foil or a film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.