Temporal pulse shaping for laser shock peening
US9744618B2 · kind B2 · utility
5Cited by
4References
5Claims
0Family size
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Key dates
| Filing date | May 23, 2015 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Dec 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/0085
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods, systems, and apparatuses are disclosed for temporal pulse shaping of laser pulses used in laser shock peening applications. In one embodiment, a system for temporal pulse shaping of a laser beam used for laser shock peening comprises a laser; a modulator; a high voltage driver, a waveform generator, a polarizer, and an optical amplifier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.