Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device
US9745411B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2014 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Jun 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13055
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 μm and less than 1 μm, not less than 1 μm and less than 10 μm, from 10 μm to 50 μm, and from 20 μm to 100 μm, and in which a peak present in a range of from 10 μm to 50 μm includes an aluminum oxide particle, and a peak present in a range of from 20 μm to 100 μm includes a boron nitride particle. In Formula (I) each of R1, R2 and R3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.