Mechanism for mitigating high heat-flux conditions in a thermosiphon evaporator or condenser
US9746247B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2015 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Jan 30, 2035 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F13/003
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to systems, devices, and methods that augment a thermosiphon system with a thermally conductive matrix material to increase the surface area to volume ratio for heat conduction at a predetermined region(s) of the thermosiphon system while minimizing capillary forces that are isolated to those region(s). The thermosiphon system has tubing including a condenser region, an evaporator region, and an adiabatic region (e.g., a region between the condenser and evaporator regions). The tubing can contain a heat transport medium and can provide passive two-phase transport of the heat transport medium between the condenser and evaporator regions according to thermosiphon principles. The system also includes a thermally conductive matrix material contained in the condenser region and/or the evaporator region but not in the adiabatic region, such that the thermally conductive matrix material increases a surface area for heat transfer in the condenser region and/or the evaporator region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.