Patent · US Active

Heat pipe structure

US9746249B2 · kind B2 · utility

1Cited by
7References
7Claims
0Family size

Assignee

Inventor

Key dates

Filing dateNov 12, 2014
Grant dateAug 29, 2017
Priority date
Expiry dateMay 28, 2035

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF28D15/0233
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

A heat pipe structure includes a first tubular body and a second tubular body. The first tubular body has a first receiving space. A first working fluid is contained in the first receiving space. The second tubular body is disposed in the first receiving space. The second tubular body has a second receiving space. A second working fluid is contained in the second receiving space. The solidification temperature of the first working fluid is different from the solidification temperature of the second working fluid so that the heat pipe structure can be activated at low temperature to keep operating at normal temperature to enhance the performance. Moreover, the assembly applicability is enhanced to lower the assembling cost.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.