Method for manufacturing substrate having concave pattern, composition, method for forming conductive film, electronic circuit and electronic device
US9746775B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2014 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Apr 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0166
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is a method for manufacturing a substrate having a concave pattern to be used for forming a high-definition pattern while suppressing wet-spreading and bleeding of a film-forming ink, provided is a composition to be used for manufacturing the substrate, and provided are a method for forming a conductive film, an electronic circuit, and an electronic device.The method for manufacturing a substrate having a concave pattern includes: (i) a step of applying, on a substrate 1, a composition containing a polymer having an acid-dissociable group and an acid generator to form a coating film 2 and (ii) a step of irradiating a predetermined portion of the coating film 2 with radiation. The method for forming a conductive film includes applying a conductive film-forming ink on the concave pattern formed in the exposed portion of the coating film 2 and heating the ink to form a pattern 6. The electronic circuit and the electronic device are provided by using the method for forming a conductive film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.