Liquid sealing material and electronic component using same
US9748158B2 · kind B2 · utility
0Cited by
0References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2016 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Jun 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A liquid sealing material which has excellent PCT (pressure cooker test) resistance, and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and the boron content in the silica filler (C) has an average of 1-50 ppm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.