Electronic device provided with an integral conductive wire and method of manufacture
US9748159B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 22, 2016 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Feb 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.