Molding type power module
US9748205B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2016 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Mar 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.