Patent · US Active

Circuit device and method for the production thereof

US9748213B2 · kind B2 · utility

0Cited by

10References

14Claims

0Family size

Assignee

Conti Temic microelectronic GmbH · DE

Inventors

Martin Steinau · Nuremberg, DE
Thomas Schmidt · Thierhaupten, DE
Bernhard Schuch · Rothenburg ob der Tauber, DE

Key dates

Filing date	Sep 26, 2014
Grant date	Aug 29, 2017
Priority date	—
Expiry date	Sep 26, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1316
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A circuit device has a base plate, a first substrate arranged on a first outer side of the base plate, a second substrate arranged on a second outer side opposite the first outer side of the base plate, at least one electrical connection element that electrically connects the first substrate and the second substrate, at least one electronic component arranged on or in the first substrate, at least one electronic component arranged on or in the second substrate, a mold package molded around the two substrates and the electronic components arranged thereon, and at least one contacting element for electrically contacting the first substrate and/or the second substrate. The at least one contacting element is electrically conductively connected to the first substrate and/or the second substrate and is led out from the mold package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.