Image sensor packages with folded cover-glass sealing interface
US9748293B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2016 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Aug 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/011
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image sensor package with a folded cover-glass sealing interface includes (a) an image sensor with a light-receiving surface, (b) a substrate having (i) a recessed surface to which the image sensor is bonded, (ii) a second surface facing in a direction parallel to optical axis of the image sensor, surrounding the recessed surface, and being further than the light-receiving surface from the recessed surface, and (iii) a third surface facing the optical axis, and adjoining and surrounding the second surface, and (c) a cover glass bonded to the substrate with a folded sealing-interface at the second surface and the third surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.