Systems, method and apparatus for curing conductive paste
US9748434B1 · kind B1 · utility
2Cited by
167References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2016 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | May 24, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment can provide a system for curing conductive paste applied on photovoltaic structures. The system can include a wafer carrier for carrying a plurality of photovoltaic structures and a heater. The wafer carrier can include a surface element that is in direct contact with the photovoltaic structures and is substantially thermally insulating. The heater can be positioned above the wafer carrier. The heater can include a heated radiation surface that does not directly contact the photovoltaic structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.