Thin-film packaging method and organic light-emitting device
US9748518B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2015 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Jan 31, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
Abstract
A thin-film packaging method and an organic light-emitting device are provided. The method includes following steps: forming an OLED layer on a TFT substrate, forming a first inorganic packaging layer on the OLED layer, forming a coupling agent unit on the first inorganic packaging layer, and forming an organic packaging layer on the coupling agent unit. Wherein, the organic packaging layer includes a buffer sublayer and a resist sublayer sequentially formed. The coupling agent unit generates chemical reactions with the first inorganic packaging layer and the buffer sublayer in order to increase an adhesive strength between the first inorganic packaging layer and the organic packaging layer so that they are not easily to be separated, and have a good water and oxygen insulation property.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.