Composite porous film having excellent heat resistance
US9748542B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Jul 30, 2013 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Jul 30, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
To provide a composite porous film in which thermal shrinkage is satisfactorily suppressed even when temperature exceeds a melting temperature of a polyolefin resin, adhesion between a microporous membrane and a heat-resistant layer is improved, and dropout of an inorganic filler is suppressed. The composite porous film is composed of the heat-resistant layer formed of the inorganic filler and a binder, and the microporous membrane formed of the polyolefin resin, and the composite porous film having a primary particle size of the inorganic filler in the range of 5 nanometers to 100 nanometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.