Modular socket panel and layer module for modular socket panel
US9748715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2015 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Nov 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R24/64
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a modular socket panel which includes a bottom layer adapted to be fixed to an embedded case in a wall and adapted to be electrically connected to a power supply provided by the embedded case, and a surface layer adapted to be directly or indirectly connected to the bottom layer in a non-fastening manner. The surface layer provides a power socket, which is electrically connected to the bottom layer. The modular socket panel disclosed in the present invention enables a user to mount a middle layer and the surface layer onto the bottom layer or remove the middle layer and surface layer from the bottom layer without any tool, and also enables the user to mount different middle layers in the modular socket panel when needed to implement different functions, for example adding more intelligent functions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.