Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers
US9748985B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2016 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Aug 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B2001/0408
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit architecture and circuitry is defined by a die structure with a plurality of exposed conductive pads arranged in a grid of rows and columns. The die structure has a first operating frequency region with a first transmit and receive chain, and a second operating frequency region with a second transmit chain and a second receive chain. There is a shared region of the die structure defined by an overlapping segment of the first operating frequency region and the second operating frequency region with a shared power supply input conductive pad connected to the first transmit chain, the second transmit chain, the first receive chain, and the second receive chain, and a shared power detection output conductive pad connected to the first transmit chain and the second transmit chain.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.