Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition
US9751988B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 16, 2015 |
| Grant date | Sep 5, 2017 |
| Priority date | — |
| Expiry date | Feb 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/296
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.