Leveling additives for electrodeposition
US9752242B2 · kind B2 · utility
3Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2014 |
| Grant date | Sep 5, 2017 |
| Priority date | — |
| Expiry date | Jan 19, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Leveling additives, their use in electrodeposition, and regeneration are described. In one embodiment, an electrodeposition bath may include a non-aqueous liquid and an optionally substituted aromatic hydrocarbon. The optionally substituted aromatic hydrocarbon may be protonated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.