Film forming apparatus and film forming method
US9752249B2 · kind B2 · utility
2Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2016 |
| Grant date | Sep 5, 2017 |
| Priority date | — |
| Expiry date | Mar 7, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film forming apparatus includes: an anode; a solid electrolyte membrane that is arranged between the anode and an substrate that serves as a cathode, and that contains metal ions; a power supply that applies a voltage between the anode and the substrate in a state in which the solid electrolyte membrane is in contact with the substrate from above; and an oscillating portion configured to oscillate at least the anode in the state in which the solid electrolyte membrane is in contact with the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.