Resistively heated shape memory polymer device
US9752562B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2016 |
| Grant date | Sep 5, 2017 |
| Priority date | — |
| Expiry date | Oct 20, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A resistively heated shape memory polymer device is made by providing a rod, sheet or substrate that includes a resistive medium. The rod, sheet or substrate is coated with a first shape memory polymer providing a coated intermediate unit. The coated intermediate unit is in turn coated with a conductive material providing a second intermediate unit. The second coated intermediate unit is in turn coated with an outer shape memory polymer. The rod, sheet or substrate is exposed and an electrical lead is attached to the rod, sheet or substrate. The conductive material is exposed and an electrical lead is attached to the conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.