Fingerprint identification module
US9754150B2 · kind B2 · utility
10Cited by
6References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 2015 |
| Grant date | Sep 5, 2017 |
| Priority date | — |
| Expiry date | Feb 9, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1324
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint identification module including a cover plate, a fingerprint identification sensor, a first adhesive layer, and at least one light source is provided. The cover plate has an inner surface, an outer surface opposite to the inner surface, and a plurality of microstructures located at the inner surface. The fingerprint identification sensor is located under the microstructures and attached to the microstructures through the first adhesive layer. The at least one light source is located under the inner surface and adjacent to the fingerprint identification sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.