Systems and methods for providing electromagnetic interference shielding for integrated circuit modules
US9754896B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2013 |
| Grant date | Sep 5, 2017 |
| Priority date | — |
| Expiry date | Sep 17, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods disclose maintaining paint thickness uniformity over the surface of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern achieves paint thickness control. A uniform coating of conductive paint provides a more effective EMI or RFI shield during the operation of the IC modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.