Method for producing a plurality of optoelectronic components and optoelectronic component
US9755114B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2013 |
| Grant date | Sep 5, 2017 |
| Priority date | — |
| Expiry date | Dec 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/851
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for producing a plurality of optoelectronic components, comprising the following steps: —providing an auxiliary support wafer (1) having contact structures (4), wherein the auxiliary support wafer comprises glass, sapphire, or a semiconductor material, —applying a plurality of radiation-emitting semiconductor bodies (5) to the contact structures (4), —encapsulating an least the contact structures (4) with a potting mass (10), and —removing the auxiliary support wafer (1). The invention further relates to an optoelectronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.