Patent · US Active

Method for forming a conductor path structure on an electrode surface of an electronic component

US9755178B2 · kind B2 · utility

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10Claims
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Key dates

Filing dateJun 13, 2014
Grant dateSep 5, 2017
Priority date
Expiry dateJun 13, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/549
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

Various embodiments may relate to a method for forming a conductor path structure on an electrode surface of an electronic component. The method includes introducing electrically conductive metal particles into an insulating carrier material, producing a mixed composition by mixing the carrier material with the metal particles, applying the mixed composition to the electrode surface, separating the metal particles from the carrier material, allowing the metal particles to become attached to the electrode surface, fixing the metal particles attached to the electrode surface, and curing the carrier material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.