Method of cutting substrate and method of manufacturing display apparatus
US9755192B2 · kind B2 · utility
4Cited by
0References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2015 |
| Grant date | Sep 5, 2017 |
| Priority date | — |
| Expiry date | Dec 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/851
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.