Housing, electronic device using same, and method for making same
US9755297B2 · kind B2 · utility
1Cited by
0References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 21, 2015 |
| Grant date | Sep 5, 2017 |
| Priority date | — |
| Expiry date | Sep 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/425
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A housing includes a substrate having an opening, a plurality of metal sheets and a plurality of non-conductive members, the metal sheets are bonded with each other through non-conductive members, forming a metal sheets member, the metal sheets member is located in the opening, the metal sheets member is bonded with substrate through the non-conductive members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.