Over-molding of sensor apparatus in eye-mountable device
US9757056B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2012 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Oct 2, 2035 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2562/12
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Example eye-mountable devices and methods for fabricating eye-mountable devices are described. A method may involve forming a first polymer layer, which defines an anterior side of the eye-mountable device and is configured to allow an analyte to diffuse therethrough. Further, the method may involve positioning a sensor apparatus on the first polymer layer, wherein the sensor apparatus comprises at least one sensor configured to detect the analyte, and wherein the at least one sensor is oriented relative to the first polymer layer to receive the analyte via diffusion through the first polymer layer. The sensor apparatus may have a height dimension of at least 50 micrometers. Still further, the method may involve forming a second polymer layer over the first polymer layer and the sensor apparatus, such that the sensor apparatus is fully enclosed by the first polymer layer and the second polymer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.