Patent · US Active

Pre-molded sub-assemblies for implantable medical leads

US9757555B2 · kind B2 · utility

29Cited by
2References
30Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 21, 2015
Grant dateSep 12, 2017
Priority date
Expiry dateApr 21, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01R2201/12
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

Pre-molded cylindrical sub-assemblies for inclusion in an implantable medical lead are described. The pre-molded cylindrical sub-assemblies comprise a cylindrical conductive element formed from a conductive material to define a substantially continuous interior surface and a substantially continuous exterior surface, and an insulative element formed from an insulative material molded onto the interior surface of the cylindrical conductive element. An interior surface of the insulative element defines a lumen of the pre-molded cylindrical sub-assembly configured to receive one or more elongated conductors of the implantable medical lead, and the cylindrical conductive element is configured to be electrically connected to one of the elongated conductors with the elongated conductors within the lumen. The cylindrical conductive element may act as an electrode, e.g., on a distal portion of the lead, or a connector, e.g., on a proximal portion of the lead.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.