Thermally decomposable polymer compositions for forming microelectronic assemblies
US9757818B2 · kind B2 · utility
1Cited by
5References
5Claims
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Key dates
| Filing date | Oct 20, 2016 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Oct 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0485
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A thermally decomposable polymer composition comprising a polyester of a dicarboxylic acid and a tertiary cyclohexanediols of Formulae V and VI are disclosed, which are useful in the forming of microelectronic assemblies:a representative example of a dicarboxylic acid is an oxalic acid and representative example of thermally decomposable polyester is the polyester of the formula:wherein m is at least about 100.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.