Patent · US Active

Methods for assembling a device for the layer-wise production of patterns

US9757831B2 · kind B2 · utility

13Cited by
95References
24Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 27, 2015
Grant dateSep 12, 2017
Priority date
Expiry dateSep 22, 2035

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49826
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

The instant invention relates to a method for assembling a device for the manufacturing patterns in layers. The method includes attaching a build module to a casing. The build module includes a spreader device and a dispensing device mounted above a mounting platform. The build module preferably includes a build platform mounted below the mounting platform. For example, the build module may be attached to the casing by screwing the mounting platform to the casing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.