Methods for assembling a device for the layer-wise production of patterns
US9757831B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2015 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Sep 22, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The instant invention relates to a method for assembling a device for the manufacturing patterns in layers. The method includes attaching a build module to a casing. The build module includes a spreader device and a dispensing device mounted above a mounting platform. The build module preferably includes a build platform mounted below the mounting platform. For example, the build module may be attached to the casing by screwing the mounting platform to the casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.