Patent · US Active

Device for hardening an electrically conductive adhesive

US9757932B2 · kind B2 · utility

0Cited by
2References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 27, 2015
Grant dateSep 12, 2017
Priority date
Expiry dateApr 27, 2035

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2605/00
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A device for curing an electrically conductive adhesive arranged between a first component and a second component. The device includes at least one punch to both apply a compressive force onto the first component in the direction of the second component, and introduce a current into the adhesive via the components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.