Device for hardening an electrically conductive adhesive
US9757932B2 · kind B2 · utility
0Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2015 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Apr 27, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2605/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A device for curing an electrically conductive adhesive arranged between a first component and a second component. The device includes at least one punch to both apply a compressive force onto the first component in the direction of the second component, and introduce a current into the adhesive via the components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.