Polymer substrate with hard coat layer and manufacturing method for such polymer substrate
US9758630B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 27, 2015 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Mar 27, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2483/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention realizes a polymer substrate with hard coating layer comprising a high level of environmental resistance and a high level of abrasion resistance.A polymer substrate with hard coating layer is provided that comprises a polymer substrate (60) having a thickness of 1 mm to 20 mm and a hard coating layer (70,80) on the surface thereof. Here, in this polymer substrate with hard coating layer, the hard coating layer (70,80) is laminated on the surface of the polymer substrate, contains as a main component thereof a hydrolysis-condensation product of an organic silicon compound, has a thickness of 0.1 μm to 20 μm, makes direct contact with a cured underlayer on the opposite side of the polymer substrate, is formed from an organic silicon compound by PE-CVD, and satisfies all of the following requirements (a) to (c): (a) film thickness of the silicon oxide layer is within the range of 3.5 μm to 9.0 μm, (b) maximum indentation depth of the surface of the silicon oxide layer as determined by measuring nanoindentation under conditions of a maximum load of 1 mN is 150 nm or less, and (c) the value of critical compression ratio K of the silicon oxide layer, as defined by f…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.