Composition for forming conductive film
US9758688B2 · kind B2 · utility
1Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2013 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Apr 21, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B13/0026
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition is provided for forming a conductive film. The composition includes a metal compound, a reducing agent, an ionic compound and/or a polar compound, and a compound having at least one atom selected from a nitrogen atom, a sulfur atom and a phosphorus atom. The composition may be an ink composition for coating on an electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.