Patent · US Active

Isotropic conductive adhesive

US9758702B2 · kind B2 · utility

0Cited by

5References

18Claims

0Family size

Assignee

Conpart AS · NO

Inventors

Helge Kristiansen · Oslo, NO
Keith Redford · Hagan, NO
Tore Helland · Lillestrøm, NO

Key dates

Filing date	May 29, 2013
Grant date	Sep 12, 2017
Priority date	—
Expiry date	May 29, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/254
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

An isotropic conductive adhesive having silver coated polymer beads within an adhesive matrix and a method of forming an isotropic conductive adhesive are disclosed. The mean average diameter of the polymer cores of the beads is less than 30 μm, and the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.