Open air plasma deposition method
US9758864B2 · kind B2 · utility
0Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2015 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Sep 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32889
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus may comprise a plasma deposition unit, a movement system, and a mesh system. The plasma deposition unit may be configured to generate a plasma. The movement system may be configured to move a substrate under the plasma deposition unit. The mesh system may be located between the plasma deposition unit and the substrate in which a mesh may comprise a number of materials for deposition onto the substrate and in which the plasma passing through the mesh may cause a portion of the number of materials from the mesh to be deposited onto the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.