Panel for forming a floor covering, method for manufacturing such panels and granulate applied herewith
US9758973B2 · kind B2 · utility
59Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2013 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Sep 1, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24868
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Panel for forming a floor covering, wherein this panel comprises at least a layer of thermoplastic material, wherein said layer also comprises at least individual fibers having a length greater than 1 millimeter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.