Joining dissimilar materials using an epoxy resin composition
US9761374B2 · kind B2 · utility
1Cited by
19References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2016 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Nov 4, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can fee used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cored, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.