Patent · US Active

Leadframe assembly, housing assembly, module assembly and method of determining at least one value of a measurement variable of an electronic module

US9761512B2 · kind B2 · utility

0Cited by

0References

14Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Stephan Preuss · Bad Abbach, DE
Michael Zitzlsperger · Regensburg, DE

Key dates

Filing date	Mar 11, 2015
Grant date	Sep 12, 2017
Priority date	—
Expiry date	Dec 23, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/12044
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A leadframe assembly is formed from an electrically conductive material. The leadframe assembly includes a first longitudinal element, at least one second longitudinal element, a plurality of first leadframe sections and a plurality of second leadframe sections.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.